Low Loss Printed Circuit Board (PCB) on Core TU-883 and Prepreg TU-883P
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.
Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station, Office Routers
Performance and Processing Advantages
Excellent electrical properties
Dielectric constant less than 4.0
Dissipation factor less than 0.005
Stable and flat Dk/Df performance over frequency and temperature
Compatible with modified FR-4 processes
Excellent moisture resistance and Lead Free reflow process compatible
Improved z-axis thermal expansion
Anti-CAF capability
Excellent through-hole and soldering reliability
Halogen Free
Our PCB Capabilities (TU-883)
| PCB Material: | High Temperature Resin |
| Designation: | TU-883 |
| Dielectric constant: | 3.60 at 1GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Appendix: Typical Properties of TU-883
| | Typical Values | Test Condition | SPEC |
| Thermal | | | |
| Tg (DMA) | 220 °C | | |
| Tg (TMA) | 170 °C | E-2/105+des | N/A |
| Td (TGA) | 420 °C | | |
| CTE z-axis α1 | 35 ppm/°C | Pre-Tg | < 60 ppm/°C |
| CTE z-axis α2 | 240 ppm/°C | Post-Tg | < 300 ppm/°C |
| CTE z-axis | 2.50% | 50 to 260°C | < 3.0% |
| Thermal Stress, Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T-260 | > 60 min | | > 30 min |
| T-288 | > 60 min | E-2/105+des | > 15 min |
| T-300 | > 60 min | | |
| Flammability | 94V-0 | E-24/125+des | 94V-0 |
| Electrical | | | |
| Permittivity (RC63%) | | | |
| 1GHz (SPC method) | 3.60 | | |
| 5GHz (SPC method) | 3.58 | C-24/23/50 | N/A |
| 10GHz (SPC method) | 3.57 | | |
| Loss Tangent (RC63%) | | | |
| 1GHz (SPC method) | 0.0030 | | |
| 5GHz (SPC method) | 0.0037 | C-24/23/50 | N/A |
| 10GHz (SPC method) | 0.0046 | | |
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | - | > 30 KV/mm |
| Dielectric Breakdown Voltage | > 50 KV | - | > 40 KV |
| Mechanical | | | |
| Young’s Modulus | | | |
| Warp Direction | 28 GPa | A | N/A |
| Fill Direction | 26 GPa | | |
| Flexural Strength | | | |
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz. Cu foil | 4~6 lb/in | A | > 4 lb/in |
| Water Absorption | 0.08% | E-1/105+des+D-24/23 | < 0.8 % |
