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Brand Name : Bicheng Technologies Limited
Model Number : BIC-181-V1.09
Certification : UL
Place of Origin : China
MOQ : 1
Price : USD 9.99-99.99
Payment Terms : T/T, Western Union
Supply Ability : 45000 pieces per month
Delivery Time : 10 working days
Packaging Details : Vacuum
Number of Layers : 2
Glass Epoxy : RF-10
Final foil : 1 Oz
Final height of PCB : 0.3 mm ±10%
Surface Finish : Immersion Gold
Solder Mask Color : Green
Colour of Component Legend : White
Test : 100% Electrical Test prior shipment
RF-10 Printed Circuit Board Low Loss High DK RF PCB 10mil 20mil 60mil Taconic RF-10 High Frequency PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
General Description
Taconic's RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass, which have the advantage of high dielectric constant (10.2 10GHz) and low dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.
 
RF-10 high frequency materials are engineered to provide a cost effective substrates, responding to a need in RF applications for size reduction. It bonds well to smooth low profile copper too. The low dissipation combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.
 
Features Benefits
1. Excellent adhesion to smooth coppers
2. Excellent dimensional stability
3. Excellent price/performance ratio
4. High thermal conductivity for enhanced thermal management
5. High DK for RF circuit size reduction
6. Low 0.0025 loss tangent @ 10 GHz
7. Low X, Y, Z expansion
8. Tight DK tolerance (10.2 +/-0.3)
 

 
Typical Applications
1. Aircraft Collision Avoidance Systems
2. GPS Antennas
3. Microstrip Patch Antennas
4. Passive Components (filters, couplers, power dividers)
5. Satellite Components
 
Our PCB Capability (RF-10)
| PCB Material: | Composites of Ceramic Filled PTFE and Woven Fiberglass | 
| Designation: | RF-10 | 
| Dielectric constant: | 10.2 | 
| Dissipation Factor | 0.0025 10GHz | 
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB | 
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | 
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) | 
| PCB size: | ≤400mm X 500mm | 
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | 
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. | 
 
RF-10 Typical Values
| Property | Test Method | Unit | Value | Unit | Value | 
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 10.2 ± 0.3 | 10.2 ± 0.3 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0025 | 0.0025 | ||
| TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 | 
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 | 
| Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 | 
| Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 | 
| Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 | 
| Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 | 
| Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 | 
| Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 | 
| Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 | 
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 | 
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 | 
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 | 
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 | 
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 | 
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 | 
| Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 | 
| Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 | 
| Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 | 
| CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 | 
| CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 | 
| Flammability Rating | Internal | V-0 | V-0 | 

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